ITC Funded Projects

Advanced Materials Area

• Advanced PCB Material Using Nano-composite as Filler 
•  An Advanced Thermal Material for Metal-Core Printed Circuit Board (MCPCB)
• Cost effective, high efficiency heat dissipation PCB for high-brightness LED 
• Development of Nano-solder for Low temperature Pb-free Electronic Interconnect Application Using a Modified Polyol Process 

Advanced Manufacturing Technology

• Development of Chelating Ion-Exchange Resin Technology for Electroplating
• Laser Direct Patterning of Graphene on Hard Substrates for Nano-electronic Fabrication 
• Development of Manufacturing Technology of Optical Printed Circuit Board 
• Development of organic and Printed Electronics manufacturing technology for high volume production 
• Development of the Liquid Crystal Polymer Printed Circuit Board Manufacturing Technology for  High-speed Application
• Development and Commercialization of Ceramic-based Printed Circuit Boards
• Development of Molded Interconnect Device Manufacturing Technology Using 3D Laser Activation of Doped Thermoplastics on 3D Printed Objects
• Laser Polishing of 3D Printed Metal Objects with Inner Structures

Microvia Drilling and Laser Dicing

• Electronics Packing Miniaturization
• High Density Interconnect (HDI) Technologies in PCB and electronic manufacture 

Microvia Metallisation and Electroplating

• A laser selective activation and metallization technology for the manufacturing of ceramic interconnect substrate(CIS)

Environmental

• An Eco-Design and Manufacturing Program for Electronic Products with reference to EuP Directive

Rigid Flex Manufacturing

• Development of Rigid Flex Printed Circuits (RFPC) manufacturing through adoption of advanced critical equipment 

Automotive Related Research

• Automotive Sub-System Design Guideline